Manually Packaging a 6.4.x BSP#
This page provides details on how to package a BSP for use with QNX Software Development Platform 6.4.x. The BSP packaging has been greatly simplified for 6.4.x. If you based your work on a previously released BSP, there should not be much to do, other than archiving and testing.
Layout#The BSP layout should be as described in the ''Building Embedded Systems'' guide.
The module.tmpl file#
IDE 4.6#The IDE no longer needs module.tmpl files, so you can omit them when you're packaging a BSP.
Prior to IDE 4.6#Each software module (e.g. driver) needs a module.tmpl file in order to successfully import a BSP into the IDE. It is highly recommended that the user upgrades to IDE 4.6 to eliminate this requirement.
The source.xml file#The root directory should have a source.xml file, which the IDE uses to import the BSP. The format of the source.xml is documented here.
New to IDE 4.6#Some new XML tags have been added to the source.xml file format to facilitate the process of importing BSPs in IDE 4.6:
The common.mk files#Ensure that each common.mk file has INSTALL_ROOT_nto and USE_INSTALL_ROOT variables defined. The INSTALL_ROOT_nto variable needs to be set to the relative path from the directory containing common.mk to the install sub-directory. The USE_INSTALL_ROOT variable needs to be set to 1.
For example, in the src/hardware/i2c/common.mk makefile the variables will be defined as follows:
INSTALL_ROOT_nto = $(PROJECT_ROOT)/../../../install USE_INSTALL_ROOT=1
Packaging the BSP#
Here's an overview of the steps required to create a BSP archive:
zip -r ../<bsp_packge_name>.zip .
Test the BSP#
After creating a BSP package, test the resulting zip file:
If there are any problems, fix the issue, and create a new archive following the steps above.